TS391AX250
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE NO
TS391AX250
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE NO
Description
General part information
TS391AX250
THERMALLY STABLE SOLDER PASTE NO
Technical Specifications
Parameters and characteristics for this part
| Specification | TS391AX250 |
|---|---|
| Composition | Pb37, Sn63 |
| Form | Jar |
| Form Weight | 8.8 oz |
| Melting Point | 361 °F |
| Mesh Type | 4 |
| Process | Leaded |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 68 °F |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources