Specification	AT28C256-25DM/883-815

Access Time	250 ns
Memory Depth	32 K
Memory Format	EEPROM
Memory Interface (Type)	Parallel
Memory Size	32 kB
Memory Type	Non-Volatile
Memory Width	8 bit
Mounting Type	Through Hole
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Package Length	0.6 in
Package Name	28-CDIP, 28-CERDIP
Package Width	15.24 mm
Technology	EEPROM
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	4.5 V
Write Cycle Time - Page	10 ms
Write Cycle Time - Word	10 ms

AT28C256 Series

...

Part	Operating Temperature (Min)	Operating Temperature (Max)	Package / Case	Write Cycle Time - Word	Write Cycle Time - Page	Memory Interface (Type)	Memory Type	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Mounting Type	Memory Format	Access Time	Technology	Memory Depth	Memory Width	Memory Size	Package Name	Package Length	Package Width
Microchip Technology AT28C256-20FM/883	-55 °C	125 °C	28-CFlatpack	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Surface Mount	EEPROM	200 ns	EEPROM	32 K	8 bit	32 kB	28-FlatPack Ceramic Bottom-Brazed
Microchip Technology AT28C256-20DM/883-815	-55 °C	125 °C		10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Through Hole	EEPROM	200 ns	EEPROM	32 K	8 bit	32 kB	28-CDIP 28-CERDIP	0.6 in	15.24 mm
Microchip Technology AT28C256-15LM/883	-55 °C	125 °C	32-CLCC	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Surface Mount	EEPROM	150 ns	EEPROM	32 K	8 bit	32 kB	32-LCC	0.45 in	13.97 mm
Microchip Technology AT28C256-25LM/883-829	-55 °C	125 °C	32-CLCC	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Surface Mount	EEPROM	250 ns	EEPROM	32 K	8 bit	32 kB	32-LCC	0.45 in	13.97 mm
Microchip Technology AT28C256E-15UM/883-815	-55 °C	125 °C	28-BCPGA	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Through Hole	EEPROM	150 ns	EEPROM	32 K	8 bit	32 kB	28-CPGA	13.97 mm	16.51 mm
Microchip Technology AT28C256-15TU-T	-40 °C	85 °C		10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Surface Mount	EEPROM	150 ns	EEPROM	32 K	8 bit	32 kB	28-TSOP 28-TSSOP	0.465 in	11.8 mm
Microchip Technology AT28C256-25FM/883-815	-55 °C	125 °C	28-CFlatpack	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Surface Mount	EEPROM	250 ns	EEPROM	32 K	8 bit	32 kB	28-FlatPack Ceramic Bottom-Brazed
Microchip Technology AT28C256E-20UM/883	-55 °C	125 °C	28-BCPGA	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Through Hole	EEPROM	200 ns	EEPROM	32 K	8 bit	32 kB	28-CPGA	13.97 mm	16.51 mm
Microchip Technology AT28C256-20LM/883	-55 °C	125 °C	32-CLCC	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Surface Mount	EEPROM	200 ns	EEPROM	32 K	8 bit	32 kB	32-LCC	0.45 in	13.97 mm
Microchip Technology AT28C256-20UM/883-815	-55 °C	125 °C	28-BCPGA	10 ms	10 ms	Parallel	Non-Volatile	5.5 V	4.5 V	Through Hole	EEPROM	200 ns	EEPROM	32 K	8 bit	32 kB	28-CPGA	13.97 mm	16.51 mm