2309NZ-1HPGGI8
ActiveIC CLK BUF 1:9 133.33MHZ 16TSSOP
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2309NZ-1HPGGI8
ActiveIC CLK BUF 1:9 133.33MHZ 16TSSOP
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 2309NZ-1HPGGI8 | 2309N Series |
|---|---|---|
| - | - | |
| Differential - Input:Output | False | False |
| Frequency - Max [Max] | 133.33 MHz | 133.33 MHz |
| Mounting Type | Surface Mount | Surface Mount |
| Number of Circuits | 1 | 1 |
| Operating Temperature [Max] | 85 °C | 70 - 85 °C |
| Operating Temperature [Min] | -40 °C | -40 - 0 °C |
| Output | LVTTL | LVTTL |
| Package / Case | 16-TSSOP | 16-TSSOP, 16-SOIC |
| Package / Case [x] | 0.173 in | 0.154 - 0.173 in |
| Package / Case [y] | 4.4 mm | 3.9 - 4.4 mm |
| Ratio - Input:Output | 1:9 | 1:9 |
| Supplier Device Package | 16-TSSOP | 16-TSSOP, 16-SOIC |
| Type | Fanout Buffer (Distribution) | Fanout Buffer (Distribution) |
| Voltage - Supply [Max] | 3.6 V | 3.6 V |
| Voltage - Supply [Min] | 3 V | 3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 2500 | $ 2.86 | |
2309N Series
Nine Output 3.3V Clock Buffer
| Part | Ratio - Input:Output | Mounting Type | Frequency - Max [Max] | Type | Differential - Input:Output | Output | Operating Temperature [Max] | Operating Temperature [Min] | Number of Circuits | Package / Case [x] | Package / Case | Package / Case [y] | Supplier Device Package | Voltage - Supply [Max] | Voltage - Supply [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics Corporation 2309NZ-1HPGGI8 | 1:9 | Surface Mount | 133.33 MHz | Fanout Buffer (Distribution) | LVTTL | 85 °C | -40 °C | 1 | 0.173 in | 16-TSSOP | 4.4 mm | 16-TSSOP | 3.6 V | 3 V | |
Renesas Electronics Corporation 2309NZ-1HDCGI | 1:9 | Surface Mount | 133.33 MHz | Fanout Buffer (Distribution) | LVTTL | 85 °C | -40 °C | 1 | 0.154 in | 16-SOIC | 3.9 mm | 16-SOIC | 3.6 V | 3 V | |
Renesas Electronics Corporation 2309NZ-1HDCG | 1:9 | Surface Mount | 133.33 MHz | Fanout Buffer (Distribution) | LVTTL | 70 °C | 0 °C | 1 | 0.154 in | 16-SOIC | 3.9 mm | 16-SOIC | 3.6 V | 3 V | |
Renesas Electronics Corporation 2309NZ-1HDCGI | |||||||||||||||
Renesas Electronics Corporation 2309NZ-1HDCG | |||||||||||||||
Renesas Electronics Corporation 2309NZ-1HDCG8 | 1:9 | Surface Mount | 133.33 MHz | Fanout Buffer (Distribution) | LVTTL | 70 °C | 0 °C | 1 | 0.154 in | 16-SOIC | 3.9 mm | 16-SOIC | 3.6 V | 3 V | |
Renesas Electronics Corporation 2309NZ-1HPGGI8 |
Description
General part information
2309N Series
The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66.6MHz, making it ideal for the low power requirements of mobile systems.
Documents
Technical documentation and resources