Specification	ESQT-122-02-G-D-358

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	20 Ąin
Contact Finish Thickness - Post	3 µin
Contact Length - Post	0.492 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Per Contact)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.358 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	44
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.079 in
Row Spacing - Mating	0.079 in
Style	Board, Board or Cable
Termination	Solder

ESQT-122 Series

...

Part	Fastening Type	Contact Finish Thickness - Mating	Mounting Type	Number of Positions Loaded	Style	Contact Finish - Post	Current Rating (Per Contact)	Connector Type	Pitch - Mating	Row Spacing - Mating	Number of Rows	Contact Type	Material Flammability Rating	Insulation Color	Contact Length - Post	Contact Finish - Mating	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Height	Termination	Contact Shape	Contact Material	Insulation Material	Contact Finish Thickness - Post
Samtec Inc. ESQT-122-02-F-D-630	Push-Pull	3 µin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.22 in	Gold	44	125 °C	-55 °C	0.63 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-02-M-D-435	Push-Pull	20 Ąin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.415 in	Gold	44	125 °C	-55 °C	0.435 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-03-S-D-350	Push-Pull	30 µin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.108 in	Gold	44	125 °C	-55 °C	0.35 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-02-L-D-500	Push-Pull	10 µin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.35 in	Gold	44	125 °C	-55 °C	0.5 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-03-F-Q-352	Push-Pull	3 µin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	4	Forked	UL94 V-0	Black	0.106 in	Gold	88	125 °C	-55 °C	0.352 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-02-G-D-800	Push-Pull	20 Ąin	Through Hole	All	Board Board or Cable	Gold	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.05 in	Gold	44	125 °C	-55 °C	0.8 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)	3 µin
Samtec Inc. ESQT-122-03-M-D-355	Push-Pull	20 Ąin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.103 in	Gold	44	125 °C	-55 °C	0.355 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-02-F-D-670	Push-Pull	3 µin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.18 in	Gold	44	125 °C	-55 °C	0.67 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-02-F-D-408	Push-Pull	3 µin	Through Hole	All	Board Board or Cable	Tin	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.442 in	Gold	44	125 °C	-55 °C	0.408 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-122-02-G-D-700	Push-Pull	20 Ąin	Through Hole	All	Board Board or Cable	Gold	4.5 A	Elevated Socket	0.079 in	0.079 in	2	Forked	UL94 V-0	Black	0.15 in	Gold	44	125 °C	-55 °C	0.7 in	Solder	Square	Phosphor Bronze	Liquid Crystal Polymer (LCP)	3 µin

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ESQT-122-02-G-D-358 | Datasheet