Specification	HLE-108-02-G-DV-BE-LC-K-TR

Connector Type	Bottom Entry, Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	20 Ąin
Contact Finish Thickness - Post	3 µin
Contact Material	Beryllium Copper
Contact Shape	Square
Contact Type	Female Socket
Current Rating (Per Contact)	4.1 A
Fastening Type	Push-Pull
Features	Pick and Place, Board Lock
Insulation Color	Black
Insulation Height	0.144 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions	16
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder
Voltage Rating	400 V

HLE-108 Series

Part	Insulation Color	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions Loaded	Termination	Style	Fastening Type	Current Rating (Per Contact)	Mounting Type	Connector Type	Contact Finish Thickness - Mating	Voltage Rating	Row Spacing - Mating	Number of Rows	Contact Type	Pitch - Mating	Insulation Height	Number of Positions	Contact Finish - Post	Contact Finish - Mating	Contact Shape	Insulation Material	Contact Material	Contact Length - Post	Features	Contact Finish Thickness - Post
Samtec Inc. HLE-150-02-F-DV	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	3 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-150-02-F-DV-TE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Receptacle	3 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.12 in
Samtec Inc. HLE-150-02-S-DV	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-150-02-L-DV-TE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Receptacle	10 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.12 in
Samtec Inc. HLE-150-02-S-DV-A-K	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		Board Guide Pick and Place
Samtec Inc. HLE-150-02-G-DV-A	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	20 Ąin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Gold	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		Board Guide	3 µin
Samtec Inc. HLE-150-02-G-DV-BE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Bottom Entry Receptacle	20 Ąin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Gold	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper			3 µin
Samtec Inc. HLE-150-02-S-DV-A-P	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		Board Guide Pick and Place
Samtec Inc. HLE-150-02-L-DV-PE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Pass Through Receptacle	10 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.09 in
Samtec Inc. HLE-150-02-S-DV-PE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Pass Through Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.09 in

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HLE-108-02-G-DV-BE-LC-K-TR | Datasheet