Specification	SL-102-G-10

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	10 µin
Contact Length - Post	0.108 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.122 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	2
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder

SL Series

...

Part	Contact Type	Number of Rows	Number of Positions	Fastening Type	Operating Temperature (Min)	Operating Temperature (Max)	Termination	Number of Positions Loaded	Insulation Height	Contact Finish - Post	Pitch - Mating	Style	Contact Length - Post	Connector Type	Mounting Type	Insulation Color	Contact Finish - Mating	Contact Shape	Contact Material	Insulation Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Samtec Inc. SL-119-TT-11	Female Socket	1	19	Push-Pull	-55 °C	105 °C	Solder	All	0.132 in	Tin	0.1 in	Board	0.108 in	Receptacle	Through Hole	Black	Tin	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. SL-107-TT-11	Female Socket	1	7	Push-Pull	-55 °C	105 °C	Solder	All	0.132 in	Tin	0.1 in	Board	0.108 in	Receptacle	Through Hole	Black	Tin	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. SL-111-G-31	Female Socket	1	11	Push-Pull	-55 °C	125 °C	Solder	All	0.05 in	Gold	0.1 in	Board		Receptacle	Through Hole	Black	Gold				30 µin
Samtec Inc. SL-107-T-39	Female Socket	1	7	Push-Pull	-55 °C	125 °C	Solder	All	0.05 in		0.1 in	Board		Receptacle	Through Hole	Black	Gold				30 µin
Samtec Inc. SL-122-G-19	Female Socket	1	22	Push-Pull	-55 °C	125 °C	Solder	All	0.05 in	Gold	0.1 in	Board	0.082 in	Receptacle	Through Hole	Black	Gold	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	30 µin	10 µin
Samtec Inc. SL-114-G-11	Female Socket	1	14	Push-Pull	-55 °C	125 °C	Solder	All	0.132 in	Gold	0.1 in	Board	0.108 in	Receptacle	Through Hole	Black	Gold				30 µin
Samtec Inc. SL-123-TT-19	Female Socket	1	23	Push-Pull	-55 °C	105 °C	Solder	All	0.05 in		0.1 in	Board	0.082 in	Receptacle	Through Hole	Black	Tin	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. SL-132-T-10	Female Socket	1	32	Push-Pull	-55 °C	125 °C	Solder	All	0.122 in		0.1 in	Board	0.108 in	Receptacle	Through Hole	Black	Gold				30 µin
Samtec Inc. SL-110-T-32	Female Socket	1	10	Push-Pull	-55 °C	125 °C	Solder	All	0.05 in		0.1 in	Board		Receptacle	Through Hole	Black	Gold	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	30 µin
Samtec Inc. SL-124-TT-12	Female Socket	1	24 pos	Push-Pull	-55 °C	105 °C	Solder	All	0.095 in	Tin	0.1 in	Board	0.095 in	Receptacle	Through Hole	Black	Tin