SMD2036-25000
ActiveChip Quik Inc.
SOLDER SPHERES SN96.5/AG3.0/CU0.
SMD2036-25000
ActiveChip Quik Inc.
SOLDER SPHERES SN96.5/AG3.0/CU0.
Description
General part information
SMD2036-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD2036-25000 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.018 in |
| Form | Jar |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Process | Lead Free |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Type | Solder Sphere |
Pricing
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CAD
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Documents
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