Description
General part information
CYT3DLABABQ1AESGS
* Microcontroller IC
Technical Specifications
Parameters and characteristics for this part
| Specification | CYT3DLABABQ1AESGS |
|---|---|
| Connectivity | LINbus, SPI, Ethernet, USART, I2C, UART, CANbus |
| Core Configuration | Dual-Core |
| Core Processor | ARM® Cortex®-M0+, ARM® Cortex®-M7F |
| Core Size (Bit Width) | 32 Bit |
| EEPROM Size (Depth) | 128 K |
| EEPROM Size (Width) | 8 bit |
| Mounting Type | Surface Mount |
| Number of I/O | 108 |
| Operating Temperature (Max) | 105 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 216-LQFP Exposed Pad |
| Package Length | 24 mm |
| Package Name | 216-TEQFP |
| Package Width | 24 mm |
| Peripherals | Temp Sensor, LVD, WDT, I2S, DMA |
| Program Memory Depth | 4.0625 M |
| Program Memory Size | 4.0625 MB |
| Program Memory Type | FLASH |
| Program Memory Width | 8 bit |
| RAM Size Depth | 384 K |
| RAM Size Width | 8 bit |
| Speed | 240 MHz |
| Voltage - Supply (Vcc/Vdd) Maximum | 5.5 V |
| Voltage - Supply (Vcc/Vdd) Minimum | 2.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources