SP3-200X100-G
ActiveBusBoard Prototype Systems
200X100MIL UNPLATED HOLE,SIZE3
SP3-200X100-G
ActiveBusBoard Prototype Systems
200X100MIL UNPLATED HOLE,SIZE3
Description
General part information
SP3-200X100-G
Breadboard, Surface Mount Non-Plated Through Hole (NPTH) Pad Per Hole (Rectangular) 0.100" (2.54mm)
Technical Specifications
Parameters and characteristics for this part
| Specification | SP3-200X100-G |
|---|---|
| Board Thickness | 0.063 in |
| Circuit Pattern | Pad Per Hole (Rectangular) |
| Hole Diameter | 0.031 in |
| Material | FR4 Epoxy Glass |
| Pitch | 0.1 in |
| Pitch (Option 1) | 0.1 in |
| Pitch (Option 2) | 0.2 in |
| Plating | Non-Plated Through Hole (NPTH) |
| Proto Board Type | Surface Mount, Breadboard |
| Size / Dimension Length | 6.3 in |
| Size / Dimension Width | 3.94 in, 3.9 in |
Pricing
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CAD
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Documents
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