XR2A-0802
ObsoleteOmron Electronics Inc-EMC Div
CONN IC DIP SOCKET 8POS GOLD
XR2A-0802
ObsoleteOmron Electronics Inc-EMC Div
CONN IC DIP SOCKET 8POS GOLD
Description
General part information
XR2A-0802
CONN IC DIP SOCKET 8POS GOLD
Technical Specifications
Parameters and characteristics for this part
| Specification | XR2A-0802 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 29.5 Ąin |
| Contact Finish Thickness - Post | 29.5 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Open Frame |
| Grid Columns | 4 |
| Grid Rows | 2 |
| Housing Material | Glass Filled, Polybutylene Terephthalate, PBT |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 8 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Post | 0.1 in |
| Row Spacing | 0.3 in |
| Termination | Wire Wrap |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
Pricing
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CAD
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Documents
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