SMD2016
ActiveChip Quik Inc.
SOLDER SPHERES SN96.5/AG3.0/CU0.
SMD2016
ActiveChip Quik Inc.
SOLDER SPHERES SN96.5/AG3.0/CU0.
Description
General part information
SMD2016
SOLDER SPHERES SN96.5/AG3.0/CU0.
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD2016 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.008 in |
| Form | Jar |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Process | Lead Free |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Type | Solder Sphere |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources