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Description

General part information

G881A12011TEU

G881A12011TEU-MICRO FIT WAFER P=

Technical Specifications

Parameters and characteristics for this part

SpecificationG881A12011TEU
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - MatingFlash
Contact Length - Post0.115 in
Contact MaterialCopper Alloy
Contact ShapeSquare
Contact TypeMale Pin
Current Rating7 A
Fastening TypeLocking Ramp
FeaturesBoard Lock
Insulation ColorBlack
Insulation Height0.34 in
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole, Right Angle
Number of Positions12
Number of Positions LoadedAll
Number of Rows2
Operating Temperature (Max)105 °C
Operating Temperature (Min)-40 °C
Pitch - Mating0.118 in
Row Spacing - Mating0.118 in
ShroudingShrouded - 4 Wall
StyleCable/Wire, Board
TerminationSolder
Voltage Rating250 V

Pricing

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CAD

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Documents

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