Specification	09-0513-10T

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Grid Columns	9
Grid Rows	1
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	9
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Type	SIP

0513 Series

Part	Contact Finish - Post	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Contact Material - Post	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Termination	Housing Material	Type	Current Rating	Material Flammability Rating	Termination Post Length	Pitch - Mating	Pitch - Post
Aries Electronics 01-0513-11H	Gold	Gold	10 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	1	1	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP
Aries Electronics 15-0513-10T	Tin	Gold	200 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	15	15	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP	3 A	UL94 V-0	0.125 in	0.1 in	0.1 in
Aries Electronics 07-0513-11H	Gold	Gold	10 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	7	7	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP				0.1 in	0.1 in
Aries Electronics 06-0513-10T	Tin	Gold	200 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	6	6 count	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP	3 A	UL94 V-0	0.125 in	0.1 in	0.1 in
Aries Electronics 02-0513-10T	Tin	Gold	200 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	2	2	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP				0.1 in	0.1 in
Aries Electronics 20-0513-11	Gold	Gold	10 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	20	20	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP	3 A	UL94 V-0	0.125 in	0.1 in	0.1 in
Aries Electronics 05-0513-11	Gold	Gold	10 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	5	5	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP				0.1 in	0.1 in
Aries Electronics 20-0513-10	Tin	Gold	200 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	20	20	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP	3 A	UL94 V-0	0.125 in	0.1 in	0.1 in
Aries Electronics 17-0513-11	Gold	Gold	10 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	17	17	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP	3 A	UL94 V-0	0.125 in	0.1 in	0.1 in
Aries Electronics 11-0513-10	Tin	Gold	200 µin	10 µin	Beryllium Copper	Through Hole	Brass	1	11	11	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	SIP	3 A	UL94 V-0	0.125 in	0.1 in	0.1 in

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09-0513-10T | Datasheet