SMDSWLF.006 50G
ActiveChip Quik Inc.
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
SMDSWLF.006 50G
ActiveChip Quik Inc.
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description
General part information
SMDSWLF.006 50G
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDSWLF.006 50G |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.006 in |
| Flux Type | Water Soluble, No-Clean |
| Form | Spool |
| Form Weight | 1.76 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Process | Lead Free |
| Shelf Life | 60 Months |
| Sn Composition | 96.5 % |
| Type | Wire Solder |
| Wire Gauge | 38 SWG, 34 AWG |
Pricing
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CAD
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