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40-6553-16

40-6553-16

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Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

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40-6553-16

40-6553-16

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

Find alt

Description

General part information

40-6553-16

CONN IC DIP SOCKET ZIF 40POS

Technical Specifications

Parameters and characteristics for this part

Specification40-6553-16
Contact Finish - MatingBoron, Nickel
Contact Finish - PostNickel Boron
Contact Finish Thickness - Mating50 µin
Contact Finish Thickness - Post50 µin
Contact Material - MatingBeryllium Nickel
Contact Material - PostBeryllium Nickel
FeaturesClosed Frame
Grid Columns20
Grid Rows2
Housing MaterialPolyetheretherketone, Glass Filled, PEEK
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)40
Operating Temperature (Max)250 °C
Operating Temperature (Min)-55 °C
Pitch - Mating0.1 in
Pitch - Post0.1 in
Row Spacing0.6 in
TerminationSolder
TypeZIF (ZIP), DIP, 0.6" (15.24mm) Row Spacing

Pricing

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CAD

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Documents

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