NC191LT50
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
NC191LT50
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
Description
General part information
NC191LT50
SMOOTH FLOW LOW TEMP SOLDER PAST
Technical Specifications
Parameters and characteristics for this part
| Specification | NC191LT50 |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57.6 % |
| Composition Elements | Sn, Ag, Bi |
| Composition Formula | Bi57.6Sn42Ag0.4 |
| Form | Jar |
| Form Weight | 1.76 oz |
| Melting Point | 280 °F |
| Mesh Type | 4 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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