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533002B02551G

533002B02551G

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Boyd Laconia, LLC

HEATSINK TO-220 SOLDERPIN/CLIP

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533002B02551G

533002B02551G

Active
Boyd Laconia, LLC

HEATSINK TO-220 SOLDERPIN/CLIP

Find alt

Description

General part information

533002B02551G

HEATSINK TO-220 SOLDERPIN/CLIP

Technical Specifications

Parameters and characteristics for this part

Specification533002B02551G
Attachment MethodClip, PC Pin
Fin Height0.5 in
Length25.4 mm
MaterialAluminum
Material FinishBlack Anodized
Package CooledTO-220
Power Dissipation2 W
ShapeFins, Rectangular
Thermal Resistance13 °C/W, 4 °C/W
TypeVertical, Board Level
Width1.375 in

Pricing

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CAD

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Documents

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