Description
General part information
IDDD10G65C6XTMA1
Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technologyCoolSiC™ Schottky diode 650 V G6is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Technical Specifications
Parameters and characteristics for this part
| Specification | IDDD10G65C6XTMA1 |
|---|---|
| Capacitance | 495 pF |
| Current - Average Rectified (Io) | 29 A |
| Current - Reverse Leakage | 33 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 175 °C |
| Operating Temperature - Junction (Min) | -55 °C |
| Package / Case | 10-PowerSOP Module |
| Package Name | PG-HDSOP-10-1 |
| Reverse Recovery Time (trr) | 0 ns |
| Speed | No Recovery Time |
| Speed - Fast Recovery (Minimum) | 500 mA |
| Speed - Recovery Current | 500 mA, 500 mA |
| Technology | SiC (Silicon Carbide) Schottky |
| Voltage - DC Reverse (Vr) (Max) | 650 V |
Pricing
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CAD
3D models and CAD resources for this part