18-1508-30
ActiveAries Electronics
CONN IC DIP SOCKET 18POS GOLD
18-1508-30
ActiveAries Electronics
CONN IC DIP SOCKET 18POS GOLD
Description
General part information
18-1508-30
CONN IC DIP SOCKET 18POS GOLD
Technical Specifications
Parameters and characteristics for this part
| Specification | 18-1508-30 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Closed Frame |
| Grid Columns | 9 |
| Grid Rows | 2 |
| Housing Material | PA46, Polyamide, Nylon 4/6 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 18 |
| Operating Temperature (Max) | 105 °C |
| Operating Temperature (Min) | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Post | 0.1 in |
| Row Spacing | 0.2 in |
| Termination | Wire Wrap |
| Type | 0.2" (5.08mm) Row Spacing, DIP |
Pricing
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CAD
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Documents
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