228-7396-55-1902
Active3M Electronic Specialty
IC & COMPONENT SOCKET, 28 CONTACTS, SOIC SOCKET, 2.54 MM, 228 SERIES, 7.62 MM, BERYLLIUM COPPER
228-7396-55-1902
Active3M Electronic Specialty
IC & COMPONENT SOCKET, 28 CONTACTS, SOIC SOCKET, 2.54 MM, 228 SERIES, 7.62 MM, BERYLLIUM COPPER
Description
General part information
228-7396-55-1902
IC & COMPONENT SOCKET, 28 CONTACTS, SOIC SOCKET, 2.54 MM, 228 SERIES, 7.62 MM, BERYLLIUM COPPER
Technical Specifications
Parameters and characteristics for this part
| Specification | 228-7396-55-1902 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Closed Frame |
| Grid Columns | 14 |
| Grid Rows | 2 |
| Housing Material | Glass Filled, Polyethersulfone, PES |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Termination | Solder |
| Type | SOIC |
Pricing
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