Specification	ESW-120-33-T-D

Connector Type	Elevated Socket
Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Length - Post	0.09 in
Contact Type	Forked
Current Rating (Per Contact)	5.2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.635 in
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	40
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder
Voltage Rating	550 V

ESW Series

...

Part	Termination	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Material Flammability Rating	Style	Contact Length - Post	Contact Finish - Post	Voltage Rating	Contact Finish Thickness - Mating	Mounting Type	Connector Type	Contact Finish - Mating	Insulation Height	Insulation Color	Current Rating (Per Contact)	Number of Positions Loaded	Pitch - Mating	Contact Type	Number of Positions	Number of Rows	Contact Material	Insulation Material	Contact Shape	Row Spacing - Mating	Contact Finish Thickness - Post
Samtec Inc. ESW-107-12-F-S	Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.09 in	Tin	550 V	3 µin	Through Hole	Elevated Socket	Gold	0.435 in	Black	5.2 A	All	0.1 in	Forked	7	1	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESW-130-23-T-D	Solder	105 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.19 in	Tin	550 V		Through Hole	Elevated Socket	Tin	0.535 in	Black	5.2 A	All	0.1 in	Forked	60	2				0.1 in
Samtec Inc. ESW-104-13-S-D	Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.29 in	Tin	550 V	30 µin	Through Hole	Elevated Socket	Gold	0.435 in	Black	5.2 A	All	0.1 in	Forked	8	2				0.1 in
Samtec Inc. ESW-109-49-F-S-LL	Kinked Pin Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.38 in	Tin	550 V	3 µin	Through Hole	Elevated Socket	Gold	0.535 in	Black	5.2 A	All	0.1 in	Forked	9	1	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESW-106-24-S-S	Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.38 in	Tin	550 V	30 µin	Through Hole	Elevated Socket	Gold	0.535 in	Black	5.2 A	All	0.1 in	Forked	6	1	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESW-118-12-T-S	Solder	105 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.09 in	Tin	550 V		Through Hole	Elevated Socket	Tin	0.435 in	Black	5.2 A	All	0.1 in	Forked	18	1
Samtec Inc. ESW-120-24-G-S	Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.38 in	Gold	550 V	20 Ąin	Through Hole	Elevated Socket	Gold	0.535 in	Black	5.2 A	All	0.1 in	Forked	20	1
Samtec Inc. ESW-113-34-L-D	Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.28 in	Tin	550 V	10 µin	Through Hole	Elevated Socket	Gold	0.635 in	Black	5.2 A	All	0.1 in	Forked	26	2	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	0.1 in
Samtec Inc. ESW-109-12-L-D	Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.09 in	Tin	550 V	10 µin	Through Hole	Elevated Socket	Gold	0.435 in	Black	5.2 A	All	0.1 in	Forked	18	2	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	0.1 in
Samtec Inc. ESW-114-12-H-S	Solder	125 °C	-55 °C	Push-Pull	UL94 V-0	Board	0.09 in	Gold	550 V	30 µin	Through Hole	Elevated Socket	Gold	0.435 in	Black	5.2 A	All	0.1 in	Forked	14	1	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square		3 µin

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

ESW-120-33-T-D | Datasheet

Drawing (PDF)