Zenode.ai Logo
SMDAL10

SMDAL10

Active
Chip Quik Inc.

ALUMINUM SOLDER PASTE WATER-SOLU

Find alt
SMDAL10

SMDAL10

Active
Chip Quik Inc.

ALUMINUM SOLDER PASTE WATER-SOLU

Find alt

Description

General part information

SMDAL10

ALUMINUM SOLDER PASTE WATER-SOLU

Technical Specifications

Parameters and characteristics for this part

SpecificationSMDAL10
Ag Composition3.5 %
Composition ElementsSn, Ag
Composition FormulaSn96.5Ag3.5
Flux TypeWater Soluble
FormSyringe
Form Volume10 cc
Form Weight0.88 oz
Melting Point430 °F
Mesh Type3
ProcessLead Free
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Sn Composition96.5 %
Storage/Refrigeration Temperature (Maximum)46 °F
Storage/Refrigeration Temperature (Minimum)37 °F
TypeSolder Paste

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Sign in to see pricing

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources