
SMDAL10
ActiveChip Quik Inc.
ALUMINUM SOLDER PASTE WATER-SOLU

SMDAL10
ActiveChip Quik Inc.
ALUMINUM SOLDER PASTE WATER-SOLU
Description
General part information
SMDAL10
ALUMINUM SOLDER PASTE WATER-SOLU
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDAL10 |
|---|---|
| Ag Composition | 3.5 % |
| Composition Elements | Sn, Ag |
| Composition Formula | Sn96.5Ag3.5 |
| Flux Type | Water Soluble |
| Form | Syringe |
| Form Volume | 10 cc |
| Form Weight | 0.88 oz |
| Melting Point | 430 °F |
| Mesh Type | 3 |
| Process | Lead Free |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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