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Description

General part information

R4F2113DBG#U0

H8S/2113 128K WIDE TEMP 176 BGA

Technical Specifications

Parameters and characteristics for this part

SpecificationR4F2113DBG#U0
A/D Channels12 count
A/D Resolution (bits)10 bit
ConnectivityFIFO, I2C, SSU, SCI, LPC, USART, UART
Converter ArchitectureSAR
Core ProcessorH8S/2000
Core Size (Bit Width)16 Bit
EEPROM Size (Depth)8 K
EEPROM Size (Width)8 bit
Mounting TypeSurface Mount
Number of I/O130
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal, External
Package / Case176-LFBGA
Package Length13 mm
Package Name176-LFBGA
Package Width13 mm
PeripheralsWDT, PWM, POR, TPU, LVD
Program Memory Depth (128KB)128 K
Program Memory Size128KB
Program Memory TypeFLASH
Program Memory Width (128KB)8
RAM Size Depth12 K
RAM Size Width8 bit
Speed20 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum3 V

Pricing

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CAD

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Documents

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