258
ActiveWakefield Thermal Solutions
HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, 6.35 MM, 8.99 MM, 13 MM
258
ActiveWakefield Thermal Solutions
HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, 6.35 MM, 8.99 MM, 13 MM
Description
General part information
258
HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, 6.35 MM, 8.99 MM, 13 MM
Technical Specifications
Parameters and characteristics for this part
| Specification | 258 |
|---|---|
| Attachment Method | Type 120 Compound |
| Fin Height | 0.34 in |
| Length | 6.35 mm |
| Material | Aluminum |
| Package Cooled | Stud Mounted Diode |
| Shape | Rectangular |
| Thermal Resistance | 12 °C/W |
| Type | Board Level |
| Width | 12.7 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources