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18-6621-30

18-6621-30

Active
Aries Electronics

CONN IC DIP SOCKET 18POS TIN

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18-6621-30

18-6621-30

Active
Aries Electronics

CONN IC DIP SOCKET 18POS TIN

Find alt

Description

General part information

18-6621-30

CONN IC DIP SOCKET 18POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification18-6621-30
Contact Finish - MatingTin
Contact Finish - PostTin
Contact Finish Thickness - Mating200 Ąin
Contact Finish Thickness - Post200 µin
Contact Material - MatingPhosphor Bronze
Contact Material - PostPhosphor Bronze
FeaturesClosed Frame
Grid Columns9
Grid Rows2
Housing MaterialNylon 4/6, Glass Filled, PA46, Polyamide
Mounting TypeBottom Entry, Through Board, Through Hole
Number of Positions or Pins (Grid)18
Operating Temperature (Max)105 °C
Operating Temperature (Min)-55 °C
Pitch - Mating0.1 in
Pitch - Post0.1 in
Row Spacing0.6 in
TerminationSolder
TypeDIP, 0.6" (15.24mm) Row Spacing

Pricing

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CAD

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Documents

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