UPTB8/TR13
Active5V – 48V POWERMITE1, SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSORS
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UPTB8/TR13
Active5V – 48V POWERMITE1, SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSORS
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | UPTB8/TR13 | UPTB8 Series |
|---|---|---|
| - | - | |
| Applications | General Purpose | General Purpose |
| Bidirectional Channels [custom] | 1 | 1 |
| Current - Peak Pulse (10/1000µs) | 10.9 A | 10.9 A |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 150 °C | 150 °C |
| Operating Temperature [Min] | -65 °C | -65 °C |
| Package / Case | DO-216AA | DO-216AA |
| Power - Peak Pulse | 1000 W | 150 - 1000 W |
| Power - Peak Pulse | 1 kW | 1 kW |
| Power Line Protection | False | False |
| Supplier Device Package | Powermite 1 (DO216-AA) | Powermite 1 (DO216-AA) |
| Type | Zener | Zener |
| Voltage - Breakdown (Min) [Min] | 9 V | 9 V |
| Voltage - Clamping (Max) @ Ipp [Max] | 13.7 V | 13.7 V |
| Voltage - Reverse Standoff (Typ) | 8 V | 8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 12000 | $ 0.66 | |
| Microchip Direct | N/A | 1 | $ 0.71 | |
| 100 | $ 0.66 | |||
| 500 | $ 0.63 | |||
| 1000 | $ 0.59 | |||
| Newark | Each | 500 | $ 0.63 | |
UPTB8 Series
5V – 48V Powermite1, Surface Mount Transient Voltage Suppressors
| Part | Package / Case | Applications | Power Line Protection | Voltage - Clamping (Max) @ Ipp [Max] | Type | Mounting Type | Voltage - Breakdown (Min) [Min] | Current - Peak Pulse (10/1000µs) | Voltage - Reverse Standoff (Typ) | Bidirectional Channels [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Power - Peak Pulse | Power - Peak Pulse | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology MXLUPTB8E3 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 1000 W | 1 kW | Powermite 1 (DO216-AA) | |
Microchip Technology UPTB8/TR13 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 1000 W | 1 kW | Powermite 1 (DO216-AA) | |
Microchip Technology MXUPTB8 | |||||||||||||||
Microchip Technology UPTB8/TR7 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 1000 W | 1 kW | Powermite 1 (DO216-AA) | |
Microchip Technology UPTB8E3/TR7 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 150 W | Powermite 1 (DO216-AA) | ||
Microchip Technology MXUPTB8E3 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 1000 W | 1 kW | Powermite 1 (DO216-AA) | |
Microchip Technology MXUPTB8 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 1000 W | 1 kW | Powermite 1 (DO216-AA) | |
Microchip Technology MXLUPTB8E3 | |||||||||||||||
Microchip Technology UPTB8E3/TR13 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 1000 W | 1 kW | Powermite 1 (DO216-AA) | |
Microchip Technology MXUPTB8E3 | |||||||||||||||
Microchip Technology UPTB8/TR13 | |||||||||||||||
Microchip Technology MXLUPTB8 | |||||||||||||||
Microchip Technology MXLUPTB8 | DO-216AA | General Purpose | 13.7 V | Zener | Surface Mount | 9 V | 10.9 A | 8 V | 1 | 150 °C | -65 °C | 1000 W | 1 kW | Powermite 1 (DO216-AA) |
Description
General part information
UPTB8 Series
Microchip’s unique and new Powermite MUPT series of transient voltage suppressors feature oxide-passivated chips with high-temperature solder bonds for high surge capability and negligible electrical degradation under repeated surge conditions. Both unidirectional and bidirectional configurations are available. In addition to its size advantages, the Powermite package includes a fully metallic bottom (anode) side that eliminates the possibility of solder flux entrapment at assembly and a unique locking tab design serves as an integral heat sink. Its innovative design makes this device fully compatible for use with automatic insertion equipment
Documents
Technical documentation and resources
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