Specification	ESS-130-T-04

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Length - Post	0.123 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.4 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	30
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder

ESS Series

...

Part	Style	Insulation Color	Contact Finish - Mating	Material Flammability Rating	Fastening Type	Contact Finish Thickness - Mating	Number of Positions Loaded	Termination	Insulation Height	Contact Finish - Post	Contact Length - Post	Mounting Type	Number of Rows	Number of Positions	Pitch - Mating	Contact Type	Connector Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post	Contact Shape	Insulation Material	Contact Material
Samtec Inc. ESS-101-G-03	Board	Black	Gold	UL94 V-0	Push-Pull	10 µin	All	Solder	0.3 in	Gold	0.123 in	Through Hole	1	1	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C	10 µin	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-122-T-03	Board	Black	Gold	UL94 V-0	Push-Pull	10 µin	All	Solder	0.3 in	Tin	0.123 in	Through Hole	1	22	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C
Samtec Inc. ESS-106-T-27	Board	Black	Gold	UL94 V-0	Push-Pull	10 µin	All	Solder	0.4 in	Tin	0.273 in	Through Hole	1	6	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C		Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-110-G-03	Board	Black	Gold	UL94 V-0	Push-Pull	10 µin	All	Solder	0.3 in	Gold	0.123 in	Through Hole	1	10	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C	10 µin	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-110-TT-23	Board	Black	Tin	UL94 V-0	Push-Pull		All	Solder	0.3 in	Tin	0.123 in	Through Hole	1	10	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C		Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-103-T-06	Board	Black	Gold	UL94 V-0	Push-Pull	10 µin	All	Solder	0.3 in	Tin	0.215 in	Through Hole	1	3	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C
Samtec Inc. ESS-118-G-07	Board	Black	Gold	UL94 V-0	Push-Pull	10 µin	All	Solder	0.4 in	Gold	0.265 in	Through Hole	1	18	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C
Samtec Inc. ESS-104-T-28	Board	Black	Gold	UL94 V-0	Push-Pull	10 µin	All	Solder	0.3 in	Tin	0.373 in	Through Hole	1	4	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C		Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-120-TT-06	Board	Black	Tin	UL94 V-0	Push-Pull		All	Solder	0.3 in	Tin	0.215 in	Through Hole	1	20	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C		Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-130-TT-04	Board	Black	Tin	UL94 V-0	Push-Pull		All	Solder	0.4 in	Tin	0.123 in	Through Hole	1	30	0.1 in	Female Socket	Elevated Socket	125 °C	-55 °C		Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper

Pricing

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Technical documentation and resources

ESS-130-T-04 | Datasheet