423A
ActiveWakefield Thermal Solutions
HEAT SINK, EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS, 0.94 °C/W, TO-3, 120.7 MM, 66.7 MM, 140 MM
423A
ActiveWakefield Thermal Solutions
HEAT SINK, EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS, 0.94 °C/W, TO-3, 120.7 MM, 66.7 MM, 140 MM
Description
General part information
423A
HEAT SINK, EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS, 0.94 °C/W, TO-3, 120.7 MM, 66.7 MM, 140 MM
Technical Specifications
Parameters and characteristics for this part
| Specification | 423A |
|---|---|
| Attachment Method | Press Fit |
| Fin Height | 2.625 in |
| Length | 139.7 mm |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | Stud Mount, TO-3, DO-5 |
| Power Dissipation | 50 W |
| Shape | Fins, Rectangular |
| Thermal Resistance | 0.96 °C/W, 0.5 °C/W |
| Type | Board Level, Extrusion |
| Width | 4.75 in |
Pricing
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CAD
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