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558-10-456M26-001104

558-10-456M26-001104

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Preci-Dip

BGA SURFACE MOUNT 1.27MM

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558-10-456M26-001104

558-10-456M26-001104

Active
Preci-Dip

BGA SURFACE MOUNT 1.27MM

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Description

General part information

558-10-456M26-001104

BGA SURFACE MOUNT 1.27MM

Technical Specifications

Parameters and characteristics for this part

Specification558-10-456M26-001104
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 µin
Contact Finish Thickness - Post10 µin
Contact Material - MatingBrass
Contact Material - PostBrass
FeaturesClosed Frame
Grid Columns26
Grid Rows26
Housing MaterialFR4 Epoxy Glass
Mounting TypeSurface Mount
Number of Positions or Pins (Grid)456
Operating Temperature (Max)125 °C
Operating Temperature (Min)-55 °C
Pitch - Mating0.05 in
Pitch - Post0.05 in
TerminationSolder
TypeBGA

Pricing

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