SMD291SNL40T7
ActiveChip Quik Inc.
SOLDER PASTE IN JAR 40G (T7) SAC
SMD291SNL40T7
ActiveChip Quik Inc.
SOLDER PASTE IN JAR 40G (T7) SAC
Description
General part information
SMD291SNL40T7
SOLDER PASTE IN JAR 40G (T7) SAC
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD291SNL40T7 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Jar |
| Form Weight | 1.41 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Mesh Type | 7 |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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