NC191LT35
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
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NC191LT35
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | NC191LT35 |
|---|---|
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Flux Type | No-Clean |
| Form | 35 g |
| Form | 1.23 oz |
| Form | 10 cc |
| Form | Syringe |
| Melting Point [custom] | 138 °C |
| Melting Point [custom] | 280 °F |
| Mesh Type [custom] | 4 |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 17.95 | |
Description
General part information
NC191LT35
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc
Documents
Technical documentation and resources