02-1518-10T

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Aries Electronics

CONN IC DIP SOCKET 2POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 2POS GOLD

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	02-1518-10T	02-1518 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	200 µin	200 µin
Contact Finish Thickness - Post	5.08 µm	5.08 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid) [custom]	1 x 2	1 x 2
Number of Positions or Pins (Grid) [custom]	2	2
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	DIP	DIP
Type	5.08 mm	5.08 mm
Type	0.2 in	0.2 in

CONN IC DIP SOCKET 2POS GOLD

Part	Type	Type	Type	Housing Material	Material Flammability Rating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Mounting Type	Pitch - Post	Pitch - Post	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Current Rating (Amps)	Contact Finish - Post	Features
Aries Electronics 02-1518-10T	DIP	5.08 mm	0.2 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	UL94 V-0	Solder	10 çin	0.25 çm	1 x 2	2	Through Hole	2.54 mm	0.1 in	Beryllium Copper	200 µin	5.08 µm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	Gold	3 A	Tin	Open Frame
Aries Electronics 02-1518-10H	DIP	5.08 mm	0.2 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	UL94 V-0	Solder	10 çin	0.25 çm	1 x 2	2	Through Hole	2.54 mm	0.1 in	Beryllium Copper	200 µin	5.08 µm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	Gold	3 A	Tin	Open Frame

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1316	$ 0.32

General part information

2 (1 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources