SMD4300SNL10
ActiveChip Quik Inc.
SOLDER PASTE WATER SOL LF 10CC
SMD4300SNL10
ActiveChip Quik Inc.
SOLDER PASTE WATER SOL LF 10CC
Description
General part information
SMD4300SNL10
SOLDER PASTE WATER SOL LF 10CC
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD4300SNL10 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Flux Type | Water Soluble, No-Clean |
| Form | Syringe |
| Form Volume | 10 cc |
| Form Weight | 1.23 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Mesh Type | 3 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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