TC1-10G
ActiveChip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
TC1-10G
ActiveChip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
Description
General part information
TC1-10G
HEAT SINK COMPOUND - HIGH DENSIT
Technical Specifications
Parameters and characteristics for this part
| Specification | TC1-10G |
|---|---|
| Color | White |
| Shelf Life | 60 Months |
| Size / Dimension Shape | Syringe |
| Size / Dimension Weight | 10 gram |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Thermal Conductivity | 0.67 W/m-K |
| Type | Silicone Compound |
| Usable Temperature Range (Max) | 302 °F |
| Usable Temperature Range (Min) | -40 °F |
Pricing
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CAD
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Documents
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