TS991SNL35T3
ActiveChip Quik Inc.
SOLDER THERMALLY STABLE SOLDER PASTE NC (NO-CLEAN) SN96.5/AG3.0/CU0.5 T3 (35G SYRINGE)
TS991SNL35T3
ActiveChip Quik Inc.
SOLDER THERMALLY STABLE SOLDER PASTE NC (NO-CLEAN) SN96.5/AG3.0/CU0.5 T3 (35G SYRINGE)
Description
General part information
TS991SNL35T3
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Technical Specifications
Parameters and characteristics for this part
| Specification | TS991SNL35T3 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Syringe |
| Form Weight | 1.23 oz |
| Melting Point | 423 °F |
| Mesh Type | 3 |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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