395-1AB
ActiveWakefield Thermal Solutions
HEAT SINK, EXTRUDED, FOR POWER SEMICONDUCTORS, 1.1 °C/W, IGBT POWER MODULE, 127 MM, 63.5 MM
395-1AB
ActiveWakefield Thermal Solutions
HEAT SINK, EXTRUDED, FOR POWER SEMICONDUCTORS, 1.1 °C/W, IGBT POWER MODULE, 127 MM, 63.5 MM
Description
General part information
395-1AB
The 395-1AB is a low-profile extruded Heat Sink made of aluminium with black anodized finish for power modules and IGBT's.
Technical Specifications
Parameters and characteristics for this part
| Specification | 395-1AB |
|---|---|
| Attachment Method | Bolt On |
| Fin Height | 2.5 in |
| Length | 3 " |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | Power Modules |
| Shape | Fins, Rectangular |
| Thermal Resistance | 0.5 °C/W, 1.1 °C/W |
| Type | Board Level |
| Width | 5 in |
Pricing
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CAD
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Documents
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