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ZSSC3218BI1D ES

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Renesas Electronics Corporation

DICE (WAFER SAWN) - WAFFLE PACK

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ZSSC3218BI1D ES

Active
Renesas Electronics Corporation

DICE (WAFER SAWN) - WAFFLE PACK

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationZSSC3218BI1D ESZSSC3218 Series
Applications-Sensor Signal Conditioner - Resistive
Contents-Board(s)
Function-Sensor Signal Conditioner
Interface-I2C, SPI
Mounting Type-Surface Mount
null-
Package / Case-24-VFQFN Exposed Pad
Supplied Contents-Board(s)
Supplier Device Package-24-QFN (4x4)
Type-Interface
Utilized IC / Part-ZSSC3218
Voltage - Supply-3.6 V
Voltage - Supply-1.68 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

ZSSC3218 Series

ZSSC3218KIT EVALUATION KIT V1.0

PartFunctionContentsUtilized IC / PartSupplied ContentsTypeInterfaceApplicationsSupplier Device PackageMounting TypeVoltage - Supply [Max]Voltage - Supply [Min]Package / Case
Renesas Electronics Corporation
ZSSC3218KITV1P0
Sensor Signal Conditioner
Board(s)
ZSSC3218
Board(s)
Interface
Renesas Electronics Corporation
ZSSC3218BI3R
I2C, SPI
Sensor Signal Conditioner - Resistive
24-QFN (4x4)
Surface Mount
3.6 V
1.68 V
24-VFQFN Exposed Pad
Renesas Electronics Corporation
ZSSC3218BI1D ES

Description

General part information

ZSSC3218 Series

DICE (WAFER SAWN) - WAFFLE PACK

Documents

Technical documentation and resources