374524B00023G
ActiveBoyd Laconia, LLC
306219 WITHOUT PAD,REV 00,00,04
374524B00023G
ActiveBoyd Laconia, LLC
306219 WITHOUT PAD,REV 00,00,04
Description
General part information
374524B00023G
Heat Sink BGA, FPGA Aluminum 1.0W @ 20°C Top Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | 374524B00023G |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Fin Height | 0.984 in |
| Length | 1.063 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | BGA, FPGA |
| Power Dissipation | 1 W |
| Shape | Square, Pin Fins |
| Thermal Resistance | 5 °C/W |
| Type | Top Mount |
| Width | 1.063 in |
Pricing
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CAD
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