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TN0702N3-G - TO-92-3(StandardBody),TO-226_straightlead

TN0702N3-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 20V, 1.3 OHM

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TN0702N3-G - TO-92-3(StandardBody),TO-226_straightlead

TN0702N3-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 20V, 1.3 OHM

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTN0702N3-GTN0702 Series
Current - Continuous Drain (Id) @ 25°C-530 mA
Drain to Source Voltage (Vdss)-20 V
Drive Voltage (Max Rds On, Min Rds On)-2 V
Drive Voltage (Max Rds On, Min Rds On)-5 V
FET Type-N-Channel
Input Capacitance (Ciss) (Max) @ Vds-200 pF
Mounting Type-Through Hole
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-TO-226-3, TO-92-3
Power Dissipation (Max)-1 W
Rds On (Max) @ Id, Vgs-1.3 Ohm
Supplier Device Package-TO-92-3
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 1.52
DigikeyBag 1$ 1.52
25$ 1.27
100$ 1.14
Microchip DirectBAG 1$ 1.52
25$ 1.27
100$ 1.14
1000$ 0.97
5000$ 0.89
10000$ 0.81

TN0702 Series

MOSFET, N-Channel Enhancement-Mode, 20V, 1.3 Ohm

PartInput Capacitance (Ciss) (Max) @ VdsDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On, Min Rds On) [Max]Drive Voltage (Max Rds On, Min Rds On) [Min]Rds On (Max) @ Id, VgsFET TypePackage / CaseVgs (Max)Current - Continuous Drain (Id) @ 25°COperating Temperature [Min]Operating Temperature [Max]Mounting TypeSupplier Device PackagePower Dissipation (Max)Vgs(th) (Max) @ IdTechnology
Microchip Technology
TN0702N3-G
200 pF
20 V
2 V
5 V
1.3 Ohm
N-Channel
TO-226-3, TO-92-3
20 V
530 mA
-55 °C
150 °C
Through Hole
TO-92-3
1 W
1 V
MOSFET (Metal Oxide)
Microchip Technology
TN0702N3-G

Description

General part information

TN0702 Series

This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.