Specification	SDL-110-G-10

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	10 µin
Contact Length - Post	0.108 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.122 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	20
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder

SDL-110 Series

Part	Contact Finish - Post	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Termination	Number of Positions	Number of Rows	Mounting Type	Fastening Type	Number of Positions Loaded	Connector Type	Insulation Height	Style	Contact Type	Row Spacing - Mating	Insulation Color	Contact Length - Post	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post	Contact Material	Insulation Material	Contact Shape
Samtec Inc. SDL-124-G-12	Gold	0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.095 in	Board	Female Socket	0.1 in	Black	0.095 in	125 °C	-55 °C	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-124-T-12		0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.095 in	Board	Female Socket	0.1 in	Black	0.095 in	125 °C	-55 °C		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-124-G-10	Gold	0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.122 in	Board	Female Socket	0.1 in	Black	0.108 in	125 °C	-55 °C	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-124-T-10		0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.122 in	Board	Female Socket	0.1 in	Black	0.108 in	125 °C	-55 °C		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular

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