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10-81070-310C

10-81070-310C

Active
Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

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10-81070-310C

10-81070-310C

Active
Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Find alt

Description

General part information

10-81070-310C

CONN IC DIP SOCKET 10POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification10-81070-310C
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating30 µin
Contact Finish Thickness - Post10 µin
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
FeaturesElevated, Closed Frame
Grid Columns5
Grid Rows2
Housing MaterialNylon 4/6, Glass Filled, PA46, Polyamide
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)10
Operating Temperature (Max)105 °C
Operating Temperature (Min)-55 °C
Pitch - Mating0.1 in
Pitch - Post0.1 in
Row Spacing0.3 in
TerminationSolder
TypeDIP, 0.3" (7.62mm) Row Spacing

Pricing

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CAD

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Documents

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