SMD291SNL500T5C
ActiveChip Quik Inc.
SOLDER PASTE SAC305 T5 500G
SMD291SNL500T5C
ActiveChip Quik Inc.
SOLDER PASTE SAC305 T5 500G
Description
General part information
SMD291SNL500T5C
SOLDER PASTE SAC305 T5 500G
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD291SNL500T5C |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Cartridge |
| Form Weight | 17.64 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Mesh Type | 5 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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