SMDLTLFP500T5C
ActiveChip Quik Inc.
SOLDER PASTE LOW TEMP T5 500G
SMDLTLFP500T5C
ActiveChip Quik Inc.
SOLDER PASTE LOW TEMP T5 500G
Description
General part information
SMDLTLFP500T5C
SOLDER PASTE LOW TEMP T5 500G
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDLTLFP500T5C |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57.6 % |
| Composition Elements | Sn, Ag, Bi |
| Composition Formula | Bi57.6Sn42Ag0.4 |
| Form | Cartridge |
| Form Weight | 17.64 oz |
| Melting Point | 281 °F |
| Mesh Type | 5 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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