10-5607-04G
ActiveBoyd Laconia, LLC
10-5607-04G
10-5607-04G
ActiveBoyd Laconia, LLC
10-5607-04G
Description
General part information
10-5607-04G
Heat Sink BGA, FPGA Aluminum 3.0W @ 70°C Board Level
Technical Specifications
Parameters and characteristics for this part
| Specification | 10-5607-04G |
|---|---|
| Attachment Method | Push Pin, Thermal Material |
| Fin Height | 0.39 in |
| Length | 1.47 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | BGA, FPGA |
| Power Dissipation | 3 W |
| Shape | Square, Fins |
| Thermal Resistance | 7 °C/W, 22.1 °C/W |
| Type | Board Level |
| Width | 1.47 in |
Pricing
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