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Description

General part information

R7F7016503ABG-C#BC1

IC MCU 32BIT 3MB FLASH 223FBGA

Technical Specifications

Parameters and characteristics for this part

SpecificationR7F7016503ABG-C#BC1
A/D Channels20 count, 16 count
A/D Resolution (bits)10 bit, 12 bit
ConnectivityCSI, USART, I2C, UART, CANbus, LINbus
Core ProcessorRH850G3KH
Core Size (Bit Width)32 Bit
EEPROM Size (Depth)128 K
EEPROM Size (Width)8 bit
Mounting TypeSurface Mount
Number of I/O174
Operating Temperature (Max)105 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package / Case233-FBGA
Package Length15 mm
Package Name233-FBGA
Package Width15 mm
PeripheralsDMA, LVD, PWM, WDT
Program Memory Depth3 M
Program Memory Size3 MB
Program Memory TypeFLASH
Program Memory Width8 bit
RAM Size Depth384 K
RAM Size Width8 bit
Speed240 MHz
Voltage - Supply (Vcc/Vdd) Maximum5.5 V
Voltage - Supply (Vcc/Vdd) Minimum3 V

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CAD

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