
PMEG100V080ELPDAZ
NRNDNexperia USA Inc.
DIODE SCHOTTKY 8A 3-PIN(2+TAB) CFP15 T/R AUTOMOTIVE AEC-Q101

PMEG100V080ELPDAZ
NRNDNexperia USA Inc.
DIODE SCHOTTKY 8A 3-PIN(2+TAB) CFP15 T/R AUTOMOTIVE AEC-Q101
Description
General part information
PMEG100 Series
Trench Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG100V080ELPDAZ |
|---|---|
| Capacitance | 110 pF |
| Current - Average Rectified (Io) | 8 A |
| Current - Reverse Leakage | 1 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 175 °C |
| Package / Case | TO-277, 3-PowerDFN |
| Package Name | CFP15 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 10 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 100 V |
| Voltage - Forward (Vf) (Max) | 850 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
CFP15; Reel pack for SMD, 7"; Q4/T2 product orientation
Nexperia package poster
Wave soldering profile
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body
Questions about package outline drawings
PMEG100V080ELPD Nexperia Product Reliability
CFP15; Reel pack for SMD, 13"; Q4/T2 product orientation
Schottky rectifiers in CFP packages
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body
CFP封装的肖特基整流器
Reflow soldering profile
Evaluation of junction temperature and thermal stacks using the virtual junction
Wave soldering guidelines for flatpack packages