BU240Z-178-HT
ObsoleteOn Shore Technology Inc.
CONN IC DIP SOCKET 24POS GOLD
BU240Z-178-HT
ObsoleteOn Shore Technology Inc.
CONN IC DIP SOCKET 24POS GOLD
Description
General part information
BU240Z-178-HT
CONN IC DIP SOCKET 24POS GOLD
Technical Specifications
Parameters and characteristics for this part
| Specification | BU240Z-178-HT |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Copper |
| Contact Finish Thickness - Mating | 78.7 Ąin |
| Contact Finish Thickness - Post | Flash |
| Contact Finish Thickness - Post (string_set) | Flash |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Open Frame |
| Grid Columns | 12 |
| Grid Rows | 2 |
| Housing Material | Glass Filled, Polybutylene Terephthalate, PBT |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 24 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Post | 0.1 in |
| Row Spacing | 0.6 in |
| Termination | Solder |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
Pricing
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CAD
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Documents
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