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VP0109N3-G - TO-92 / 3

VP0109N3-G

Active
Microchip Technology

MOSFET, P-CHANNEL ENHANCEMENT-MODE, -90V, 8.0 OHM

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VP0109N3-G - TO-92 / 3

VP0109N3-G

Active
Microchip Technology

MOSFET, P-CHANNEL ENHANCEMENT-MODE, -90V, 8.0 OHM

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationVP0109N3-GVP0109 Series
--
Current - Continuous Drain (Id) @ 25°C250 mA250 mA
Drain to Source Voltage (Vdss)90 V90 V
Drive Voltage (Max Rds On, Min Rds On) [Max]10 V10 V
Drive Voltage (Max Rds On, Min Rds On) [Min]5 V5 V
FET TypeP-ChannelP-Channel
Input Capacitance (Ciss) (Max) @ Vds60 pF60 pF
Mounting TypeThrough HoleThrough Hole
Operating Temperature [Max]150 °C150 °C
Operating Temperature [Min]-55 °C-55 °C
Package / CaseTO-226-3, TO-92-3TO-226-3, TO-92-3
Power Dissipation (Max)1 W1 W
Rds On (Max) @ Id, Vgs [Max]8 Ohm8 Ohm
Supplier Device PackageTO-92-3TO-92-3
TechnologyMOSFET (Metal Oxide)MOSFET (Metal Oxide)
Vgs (Max)20 V20 V
Vgs(th) (Max) @ Id3.5 V3.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBag 1$ 1.16
25$ 0.98
100$ 0.89
Microchip DirectBAG 1$ 1.16
25$ 0.98
100$ 0.89
1000$ 0.75
5000$ 0.69
10000$ 0.63

VP0109 Series

MOSFET, P-Channel Enhancement-Mode, -90V, 8.0 Ohm

PartVgs (Max)Drain to Source Voltage (Vdss)FET TypeMounting TypePackage / CaseRds On (Max) @ Id, Vgs [Max]Input Capacitance (Ciss) (Max) @ VdsSupplier Device PackageVgs(th) (Max) @ IdCurrent - Continuous Drain (Id) @ 25°CTechnologyDrive Voltage (Max Rds On, Min Rds On) [Max]Drive Voltage (Max Rds On, Min Rds On) [Min]Operating Temperature [Min]Operating Temperature [Max]Power Dissipation (Max)
Microchip Technology
VP0109N3-G
20 V
90 V
P-Channel
Through Hole
TO-226-3, TO-92-3
8 Ohm
60 pF
TO-92-3
3.5 V
250 mA
MOSFET (Metal Oxide)
10 V
5 V
-55 °C
150 °C
1 W
Microchip Technology
VP0109N3-G

Description

General part information

VP0109 Series

This enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.