SM671PEC-BFSS
ActiveSilicon Motion, Inc.
BGA-153(11.5X13) NAND FLASH ROHS
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SM671PEC-BFSS
ActiveSilicon Motion, Inc.
BGA-153(11.5X13) NAND FLASH ROHS
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SM671PEC-BFSS |
|---|---|
| Memory Format | FLASH |
| Memory Interface | UFS3.1 |
| Memory Size | 160 Mbit |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 153-TBGA |
| Supplier Device Package | 153-BGA |
| Supplier Device Package [x] | 11.5 |
| Supplier Device Package [y] | 13 |
| Technology | FLASH - NAND (SLC) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
SM671PEC-BFSS
FLASH - NAND (SLC) Memory IC 160Gbit UFS3.1 153-BGA (11.5x13)
Documents
Technical documentation and resources