Description
General part information
CYT3DLBBDBQ1BZSGS
* Microcontroller IC
Technical Specifications
Parameters and characteristics for this part
| Specification | CYT3DLBBDBQ1BZSGS |
|---|---|
| A/D Channels | 48 count |
| A/D Resolution (bits) | 12 bit |
| Connectivity | LINbus, SPI, Ethernet, USART, I2C, UART, CANbus |
| Converter Architecture | SAR |
| Core Configuration | Dual-Core |
| Core Processor | ARM® Cortex®-M0+, ARM® Cortex®-M7F |
| Core Size (Bit Width) | 32 Bit |
| EEPROM Size (Depth) | 128 K |
| EEPROM Size (Width) | 8 bit |
| Mounting Type | Surface Mount |
| Number of I/O | 135 |
| Operating Temperature (Max) | 105 °C |
| Operating Temperature (Min) | -40 °C |
| Oscillator Type | Internal, External |
| Package / Case | 272-LFBGA |
| Package Length | 16 mm |
| Package Name | 272-BGA |
| Package Width | 16 mm |
| Peripherals | Temp Sensor, LVD, WDT, I2S, DMA |
| Program Memory Depth | 4.06 M |
| Program Memory Size | 4.06 MB |
| Program Memory Type | FLASH |
| Program Memory Width | 8 bit |
| RAM Size Depth | 384 K |
| RAM Size Width | 8 bit |
| Speed | 240 MHz, 100 MHz |
| Voltage - Supply (Vcc/Vdd) Maximum | 5.5 V |
| Voltage - Supply (Vcc/Vdd) Minimum | 2.7 V |
Pricing
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CAD
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Documents
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